히트 파이프와 증기 챔버 (VC)는 고출력 또는 고집적 전자 제품에 널리 사용됩니다. 적절하게 사용될 경우, 히트 파이프와 증기 챔버는 열전도율이 매우 높은 부품으로 간단히 이해할 수 있습니다. 히트 파이프와 증기 챔버가 확산 열저항을 효과적으로 제거할 수 있다는 점은 쉽게 알 수 있습니다.
주요 단어
히트 파이프
증기 챔버
기사 내용
The most common application example of heat pipe is embedded in the heat sink, the heat of the chip fully spread on the radiator substrate or fin. When the heat emitted by the chip is transferred to the radiator through the heat-conducting interface material, the heat can be transmitted along the heat pipe with very low thermal resistance due to the high thermal conductivity of the heat pipe. In this case, the heat pipe is connected to the radiator fin, so that the heat can be more effectively dissipated through the radiator into the air. For the heat sink embedded only in the substrate, when the heating area of the chip is relatively small, it is directly transferred to the substrate of the radiator, which will make the temperature distribution of the substrate have a large non-uniformity. After the addition of heat pipes, due to the high thermal conductivity of heat pipes, it can effectively reduce the uneven temperature and improve the heat dissipation efficiency of the heat sink.
Heat pipe and VC have high equivalent thermal conductivity because their internal heat transfer mechanism is phase transformation heat. From the range of surface heat transfer coefficient, it can be seen that the phase transformation heat is the most efficient convective heat transfer. In heat pipe or VC, boiling heat transfer is carried out in the evaporation section, and steam condensation is carried out in the condensation section.
The most important performance indexes of heat pipe and VC are the maximum heat transfer Qmax, thermal resistance R and starting temperature T0. Defined respectively as follows: maximum heat transfer rate Qmax: the calorific value of Qmax value equal to the following situation: heat pipe evaporation or VC joint calorific value of Q fever source, the measured temperature difference between evaporation and condensation within the prescribed scope (usually used in engineering 5 ℃ as decision criteria), the unit is W. thermal resistance R: when heat transfer size of Q, the actual measured the temperature difference between the evaporator and condenser Δ T, thermal resistance value is Δ T/Q, the unit is ℃ / W or K/W.
Starting temperature T0: The heat pipe is a process of evaporation and condensation. But the evaporation and condensation of fluid must occur under certain temperature and pressure conditions. Starting temperature T0 refers to the minimum temperature required for the formation of phase transformation heat cycle in the heat pipe or VC cavity.
There are many factors affecting the performance of heat pipe and VC, and the mechanism analysis needs to clarify the heat transfer process in the cavity. When the evaporation section of the heat pipe is heated, the liquid in the suction core inside the evaporation section evaporates, and the pressure here increases, and the vapor transfers to the condensing section under the action of pressure difference. When the gas is transferred to the condensate section, it is condensed into a liquid. The condensed liquid is transferred to the evaporation section through capillary force in the suction core, forming a cycle. As follows:
R1 : 열원과 증발부 외벽 사이의 (대류) 열전달 저항
R2: 증발부 벽의 방사상 열전도 저항.
R3: 증발부 흡입 코어의 (방사형) 열전도 저항
R4 : 증발부 내면의 증발열교환 열저항
R5 : 증기 축류의 열저항
R6 : 응축부 내면의 응축열교환 열저항
R7 : 응축구간 흡입코어의 열전도 저항
R8: 응축부 관벽의 열전도 저항
R9 : 냉원 및 응축부 외벽면의 (대류) 열전달 저항 R10 : 관벽 및 흡입 코어의 축방향 열저항
